BREAKING NEWS: ZESTRON to Present at SMTA Juárez Expo and Tech Forum
New products

New 3D X-ray system from Viscom: extremely fast handling coupled with high inspection depth

Mar 30, 2017

SMT Hybrid Packaging, hall 4A, stand no. 122   Viscom AG is showing off the X7056-II, its newest system for automatic 3D X-ray inspection, at this year’s SMT Hybrid Packaging trade fair, May 16-18, in Nuremberg, Germany. Very short handling times in combination with outstanding image quality and expanded inspection depth predestine this X-ray inspection
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Altus Offer New Fast Surface Mounter

Altus Group, a leading distributor of capital equipment for the electronics assembly industry, has announced the inclusion of a new surface mounter from Yamaha which is the world’s fastest in its class. YSM10 is a compact, high-speed model which also boasts space-saving qualities. It offers a number of benefits called the ‘Three-One’ concept which includes
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Viscom presents new high-resolution camera module for in-line wire bond inspection

Mar 23, 2017

Viscom AG offers the new XM Bond HR camera module for dependable inspection of wire bonds. Its characteristics include a 21 mm x 21 mm field of view size and exceptionally fine detail resolution. It is ideally suited for the most precise inspection of thin wires in the production line. With the new XM Bond HR camera
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New Smart Profilers – KIC SPS

KIC today announced plans to introduce its new thermal profiler. This new reflow profiler transforms thermal process data collection from a costly chore to a value-added function. The core function of a reflow oven is to produce an acceptable profile on each PCB. The new KIC SPS smart profiler collects the profile data and compares
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Engineered Material Systems, Inc. Develops Negative Photoresist for MEMS and IC Wafers

Engineered Material Systems, Inc., a leading global supplier of negative photoresist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-35120 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (TSV sealing). The dry film is 120 µm thick. This material formulation has been optimized
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Engineered Material Systems to Showcase CA-150 Series Conductive Adhesives for Next-Generation Solar Modules at the SNEC PV Power Expo

Mar 16, 2017

Engineered Material Systems, Inc. (EMS), a leading global supplier of conductive interconnect materials for photovoltaic applications, announces the introduction of its new CA-150 Series Snap Cure, Low Cost Conductive Adhesive for stringing and shingling crystalline silicon and Heterojunction solar modules. The new conductive adhesive will be displayed in Hall W3, booths 806/807 at the SNEC
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Hanwha Techwin Debuts New Features on Pick-and-Place Systems

Mar 2, 2017

Hanwha Techwin Automation Americas, Inc., formerly Samsung C&T Automation, today announced new PLUS features on its next-generation SM Series pick-and-place systems. Features include higher resolution drive motors that increase chip placement accuracy by 20 percent, flying vision verification for pre- and post-placement process enhancements, and compatibility with optional electrical test verification and progressive build capability
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New Rapid Dual Thermal Defect Detection & Component / Solder-Joint Validation from PDR Americas

PDR, a leader in IR rework, test and inspection, is pleased to introduce the new PDR IR-TS Series of micro-focused HALT/HASS thermal test systems. The PDR IR-TS One Bench Top System and TS-2100 Cabinet System have been designed to thermally cycle key critical components and assemblies to detect defects. Applications include testing electronic assemblies, electronic
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Metcal Introduces the Next Big Step in Process Control: Connection Validation™

Metcal’s CV-5200 Connection Validation™ Soldering Station provides real-time closed loop feedback on intermetallic compound formation— the world’s first. Plus, a new communication port enables process traceability and firmware upgrades. Metcal announced today the introduction of its breakthrough CV-5200 Connection Validation™ Soldering Station. Connection Validation™ provides operators with real-time, closed loop feedback, via a green or
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Nordson MARCH’s New Plasma Polymerization Deposition Systems Deposit Materials During Precision Manufacturing Processes

Feb 9, 2017

Uniform film coating changes surface characteristics of the substrate   Nordson MARCH, a Nordson company (NASDAQ: NDSN), a global leader in plasma cleaning and surface treatment technology, introduces its PD Series Plasma Deposition Systems family, which uses plasma polymerization to deposit thin films uniformly during precision manufacturing and assembly processes to change the surface characteristics
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