Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, today announced plans to exhibit in Booth #3525 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 – March 1, 2018 at the San Diego Convention Center in Ca. The company will present a large all-in-one platform that can be used for the assembly of high-speed applications, rapid prototyping and high-speed dispensing. With different modules, the system can grow synchronously with customer requirements for performance and processes. The company also will demonstrate the compact Spider jet dispenser and two FOX² systems – one with the solder paste Jet valve and one with the micro screw valve.
Puma and Tarantula
Puma is world’s the first high-speed pick-and-place solution that can also be used in the ultra-flexible prototyping development sector. With an IPC assembly performance of 18’100 cph, the machine pushes forward into the mid-range field. To further increase flexibility, it boasts up to 280 feeder positions; this means Puma offers the highest number of feeders in relationship to the machine’s foot print. It processes PCB sizes up to 1’800 mm x 610 mm.
Aside from handling the assembly processes, Puma also dispenses and jets in parallel up to 150’000 dots per hour. When all three axis are used exclusively for dispensing fluids, the platform is called Tarantula. There are five valve technologies to choose from, and with the plug-and-play method, all heads can be retrofitted or changed over on site.
The newly implemented linear motor technology paired with the material “Epument” for the mineral cast frame gives a speed increase of up to 52.5 percent versus the previous model. The updated vibration absorption through the mineral cast frame guarantees high and consistent accuracy over many years of use. Replacing the traditional spindles and belts with the linear motor technology means the required maintenance is significantly reduced. Additionally, the assembly and dispensing processes are displayed on the same X/Y system.
The system’s software also has been optimized. The clearly structured interface on a large touch screen monitor is as easy to operate as a smart phone. This enables the operator to process both simple assembly groups as well as more complex projects with mixed processes, 2.5D applications and more, direct on the machine. The management can check the efficiency of the machine at any time and Essemtec offers on-line support service.
The new FOX2 by Essemtec combines jetting of solder paste or glue and placement in a single machine. FOX2 has a machine footprint of just 1m2 and can accept PCB sizes up to 16 x 12″. Components with sizes from 01005 up to 1.3 x 3.1″are placed. The machine achieves 7,500 cph (IPC9805A) at 50 µm, 3 sigma with a two nozzle head.
The Spider can utilize two dispensing Jet valves rated at up to 150,000 dots per hour. It dispenses 3D patterns and is easily adapted to your application. The Spider occupies only 1 m² of floor space and features linear motor drives for high accuracy: 40 µm (3σ) at full speed. Job changeover is quick with intuitive CAD import and job preparation. Mapping of heights by laser technology enables 3D applications. A mineral-cast chassis provides stability at varying temperatures.