BREAKING NEWS: EVS Improves the Wave Solder Process – Visit Booth #3433 at APEX
New products

KYZEN’s Newest Innovation, the KYZEN ANALYSTtm, Will Be Launched at SMT Hybrid Packaging 2017 this May!

Apr 20, 2017

Today KYZEN announced plans to introduce the new KYZEN ANALYST in Europe this spring at SMT Hybrid Packaging 2017. KYZEN will have live, on-site demonstrations of their latest innovation, the KYZEN ANALYST, at the show in Hall 4A, Stand 536. The show is scheduled to take place May 16-18, 2017 at the Messe in Nuremberg,
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Microtronic GmbH Enters Distribution Agreement with Pemtron for Scanning Electron Microscopes

Apr 13, 2017

Microtronic GmbH, a leading sales specialist of microelectronics, is pleased to announce that it has added the PEMTRON PS™ Series Scanning Electron Microscopes (SEMs) to its product line up in parts of the EU. The PS Series Models include the PS-210 Compact Desk Top Mini-SEM, the PS-230 High Performance Normal-SEM, and PS-250 Analytical Normal-SEM. The
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New High Throughput Dispense Pump from Techcon Systems

Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, is pleased to announce the launch of its new Positive Displacement PC Pump – TS8100-200. The TS8100 PC pump series will have many configurations. Techcon launched the smallest configuration – TS8100-100 – in October.  The TS8100-200 is
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Hanwha Techwin Introduces Flying Vision Verification to Component Mounters

Apr 6, 2017

Hanwha Techwin Automation Americas, Inc., formerly Samsung C&T Automation, today announced the introduction of Flying Vision Verification to SM Plus component mounters. Flying Vision Verification utilizes on-the-head, upward-looking camera systems to verify presence of multiple components simultaneously following pickup, then verify alignment of multiple components simultaneously prior to placement, and finally verify placement of multiple
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New 3D X-ray system from Viscom: extremely fast handling coupled with high inspection depth

Mar 30, 2017

SMT Hybrid Packaging, hall 4A, stand no. 122   Viscom AG is showing off the X7056-II, its newest system for automatic 3D X-ray inspection, at this year’s SMT Hybrid Packaging trade fair, May 16-18, in Nuremberg, Germany. Very short handling times in combination with outstanding image quality and expanded inspection depth predestine this X-ray inspection
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Altus Offer New Fast Surface Mounter

Altus Group, a leading distributor of capital equipment for the electronics assembly industry, has announced the inclusion of a new surface mounter from Yamaha which is the world’s fastest in its class. YSM10 is a compact, high-speed model which also boasts space-saving qualities. It offers a number of benefits called the ‘Three-One’ concept which includes
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Viscom presents new high-resolution camera module for in-line wire bond inspection

Mar 23, 2017

Viscom AG offers the new XM Bond HR camera module for dependable inspection of wire bonds. Its characteristics include a 21 mm x 21 mm field of view size and exceptionally fine detail resolution. It is ideally suited for the most precise inspection of thin wires in the production line. With the new XM Bond HR camera
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New Smart Profilers – KIC SPS

KIC today announced plans to introduce its new thermal profiler. This new reflow profiler transforms thermal process data collection from a costly chore to a value-added function. The core function of a reflow oven is to produce an acceptable profile on each PCB. The new KIC SPS smart profiler collects the profile data and compares
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Engineered Material Systems, Inc. Develops Negative Photoresist for MEMS and IC Wafers

Engineered Material Systems, Inc., a leading global supplier of negative photoresist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-35120 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (TSV sealing). The dry film is 120 µm thick. This material formulation has been optimized
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Engineered Material Systems to Showcase CA-150 Series Conductive Adhesives for Next-Generation Solar Modules at the SNEC PV Power Expo

Mar 16, 2017

Engineered Material Systems, Inc. (EMS), a leading global supplier of conductive interconnect materials for photovoltaic applications, announces the introduction of its new CA-150 Series Snap Cure, Low Cost Conductive Adhesive for stringing and shingling crystalline silicon and Heterojunction solar modules. The new conductive adhesive will be displayed in Hall W3, booths 806/807 at the SNEC
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