Advanced APS2 technology incorporates a wider range of particle sizes in sensors that speed processes and improve yields

CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high precision 3D sensing technology solutions, announces it will demonstrate its next-generation Airborne Particle Sensor technology (APS2) with an extended particle size range at SEMICON Korea, February 8-10th at the COEX in Seoul, Booth # 2220.

CyberOptics’ APS2 portfolio speeds equipment set-up and long-term yields in semiconductor fabs by wirelessly monitoring airborne particles in real-time. The next-generation APS2 provides even greater versatility, with the industry-leading accuracy and sensitivity valued by semiconductor fabs and equipment OEMs worldwide.

Both the WaferSense® and ReticleSense® Airborne Particle Sensors (APS2, APSR and APSRQ) can measure small and large particles. The new large particle detecting and measurement functionality covers a range of sizes with four bins for particles larger than 2, 5, 10 and 30 microns.

“Our APS2 sensors are widely used to detect, identify and monitor airborne particles in the leading semiconductor fabs around the globe,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics. “Extending the measurement capability range in the same device provides an efficient solution for our customers that improves yields.”

At SEMICON Korea, CyberOptics will also demonstrate its WaferSense and ReticleSense Auto Multi Sensors (AMS/AMSR) that measure leveling, vibration, and relative humidity (RH) in an all-in-one wireless real-time device.  The thin and light form factor enables the AMS to travel through virtually any tool and the AMSR can capture multiple measurements in all locations of the reticle environment.  The all-in-one devices are yet another way to increase yield and reduce downtime in semiconductor environments.

About the WaferSense and ReticleSense Line

The WaferSense measurement portfolio including the Auto Leveling System (ALS), the Auto Gapping System (AGS), the Auto Vibration System (AVS), the Auto Teaching System (ATS), the Airborne Particle Sensor (APS), the advanced Airborne Particle Sensor (APS2) and the new Auto Multi Sensor (AMS) are available in various wafer shaped form factors depending on the device, including 150mm, 200mm and 300mm wafer sizes. The ReticleSense measurement portfolio including the Airborne Particle Sensor (APSR & APSRQ) and next-generation APS2, the Auto Leveling System (ALSR) and the Auto Multi Sensor (AMSR) are available in a reticle shaped form factor.

For more information about the entire line of CyberOptics solutions please visit www.cyberoptics.com.