Alpha Assembly Solutions, the world leader in the production of electronic soldering materials, will be presenting three technical papers “LED Die Attach Technologies – Trend and Considerations”, “High Reliability Interconnects for High Power LED Assembly” and “Methods for Minimizing Voiding in Surface Mount BGA and BTC Device Interconnects” at South East Asia Technical Conference which is hosted by SMTA from April 13-14, 2016 at Eastin Hotel in Penang, Malaysia.
The first paper titled “LED Die Attach Technologies – Trend and Considerations” will focus on the key role die-attach materials play in the performance and reliability of mid-power to super-high power LEDs. The presentation will provide an overview of different die attach technology platforms and discuss their attributes and fit with different chip structures operating at different power levels.
The second paper is titled “High Reliability Interconnects for High Power LED Assembly”. The topic addresses the need and impact for higher reliability interconnects for LED based outdoor and commercial lighting. The presentation will focus on the results of a recent assembly and reliability study of high power ceramic LEDs on aluminum metal core PCBs, and detail the impact of solder alloys on reliability.
The third paper titled “Methods for Minimizing Voiding in Surface Mount BGA and BTC Device Interconnects” will evaluate the causes of voids and focus on the methods of eliminating them. Six methods of reducing or eliminating voids in SMT applications will be discussed. Three of the techniques are process based adjustments and three involve the optimization of materials used in solder paste. These methods include:
- Reflow profile optimization
- Use of vacuum during reflow
- Managing the solder paste deposit volume through stencil design
- Solder paste chemistry selection
- Choice of solder powder particle size distribution
- Use of solvent-free joining materials
For more information on Alpha’s vast product offering and capabilities, visit AlphaAssembly.com
TECHNICAL PAPER PRESENTATION:
Wednesday, 13th April 2016 | 11:15-11:45
Topic: LED Die Attach Technologies – Trend and Considerations
Speaker: Gyan Dutt, Technical Marketing Manager of LED – Alpha Assembly Solutions
Wednesday, 13th April 2016 | 17:15-17:45
Topic: High Reliability Interconnects for High Power LED Assembly
Speaker: Amit Patel, Project Manager of LED – Alpha Assembly Solutions
Wednesday, 14th April 2016 | 15:00-15:30
Topic: Methods for Minimizing Voiding in Surface Mount BGA and BTC Device Interconnects
Speaker: Mok Tuck Weng, Manager of Global Application Technology & Engineering – Alpha Assembly Solutions
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