AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Timothy O’Neill, AIM’s Technical Marketing Manager, will present his white paper “A Practical Guide to Optimizing Solder Paste Performance for Ultra-Fine Feature Printing” at a cleaning and reliability workshop on April 12th, 2016 from 1:50pm – 2:40pm at North Carolina State University in Raleigh, North Carolina. The workshop will also be held on April 14th, 2016 in Asheville, North Carolina at Asheville-Buncombe Technical Community College.
O’Neill’s white paper covers the optimization of solder paste performance from receiving to reflow. The discussion topics will include paste handling, stencil design, printer set up and common defects. The presentation incorporates theory with best practice to inform the process engineer of the how, what and why of solder paste use.
Timothy O’Neill has over 20 years of experience in the solder assembly for electronics industry, including extensive knowledge with fine pitch solder paste dispensing technology. He has assisted and solved numerous clients’ production challenges. O’Neill is also a technical writer and presenter for industry trade publications and events.
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