AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, will highlight their innovative M8 No Clean Solder Paste along with their full line of solder assembly materials at the SMTA International 2016 trade show, scheduled to take place on September 27th – September 28th, 2016 at the Donald Stephens Convention Center in Rosemont, Illinois.  AIM will be located in booth 609.

M8 No Clean Solder Paste has been formulated to improve production yields and product quality, whether printing 0.50 area ratios or eliminating voiding on QFN and LED packages.  M8’s post-reflow residue passes all IPC, BONO and tough changing environment test specifications, making it the ideal choice for automotive and high performance/high reliability applications.

Additionally, AIM’s Technical Marketing Manager, Timothy O’Neill, will be presenting at SMTA International’s technical conference, on September 27th at 2:00 PM. O’Neill’s presentation, “Evaluating the Impact of Solder Alloy Powder Size and Stencil Foil Mounting Tension on Overall Print Quality of Miniaturized Devices,” explores the use of Type 4 and Type 5 solder paste powders on non-coated stencil foils at standard and high mounting tensions, and compares release, repeatability and print definition characteristics.

To discover all of AIM’s products and services, visit the company in booth number 609 at SMTA International.