KYZEN announces that its AQUANOX® A8820 Advanced Aqueous Stencil Cleaner provides many user benefits.

AQUANOX® A8820 is an engineered Micro Cell Technology (MCT™) cleaning fluid designed to remove wet solder paste and uncured chip bonder adhesive from stencils used in surface mount printing processes. It effectively removes common solder pastes and fluxes, and demonstrates a favorable compatibility profile with stencil cleaning systems.

A8820 works well with spray-in-air and select ultrasonic cleaning machines, and is effective on uncured adhesives. Additionally, the no-foaming property of A8820 is compatible with all materials commonly used in electronic assembly manufacturing and cleaning processes.

KYZEN’s AQUANOX® A8820 has been designed from the ground up for the tough challenges of cleaning no-clean, lead-free residue from small, 1005 apertures while being compatible with modern nano-coatings as well as with all of the modern offline cleaning equipment that is popular in the industry. A8820 is a quick drying product that also is rapidly rinsed if water rinsing is preferred.

AQUANOX® A8820 is available in five, 25 and 200 liter drums. In addition to A8820, KYZEN offers a full line of precision cleaning chemistries to meet any cleaning challenge. For more information, call the KYZEN inside technical team at 615-236-6784.

KYZEN® and AQUANOX® are registered trademarks in the United States and other countries.