Engineered Materials Systems, a leading global supplier of conductive interconnect materials for electronics applications, today announced its new EMS 561-338 Fast Cure Conductive Adhesive for die attach applications with small to medium size die. EMS 561-338 is designed to cure in less than one minute at 150ºC.
The adhesive is stress-absorbing to withstand the rigors of thermal cycling and features excellent conductive stability. The material can be applied by stencil printing or needle dispensing.
The 561-338 conductive die attach adhesive is the latest addition to Engineered Conductive Materials’ full line of conductive adhesives for circuit assembly applications. For more information about the EMS 561-338 Fast Cure Conductive Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.
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