AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation at the SMTA Capital Expo & Tech Forum, scheduled to take place August 30th, 2016 at the Johns Hopkins University in Laurel, Maryland. AIM will highlight their revolutionary M8 solder paste along with their full line of solder assembly materials.

M8 No Clean Solder Paste has been formulated to address the most demanding requirements confronting today’s SMT assembly market. M8 is proven to improve production yields and product quality, whether printing 0.50 area ratios or eliminating voiding on QFN and LED packages.  M8’s post-reflow residue passes all IPC, BONO and tough changing environment test specifications, making it the ideal choice for automotive and high performance/high reliability applications. M8’s robust characteristics and stable performance improves every facet of the PCB assembly process.

Additionally, AIM will highlight its liquid fluxes, tin/lead and lead-free alloys, including SN100C. To discover all of AIM’s products and services, including lead-free and halogen-free solder, visit the company at the SMTA Capital Expo & Tech Forum for more information.