TopLine announces an upgraded Column Planarizing Tool for precise trimming of CCGA Solder Columns to ensure planarity across the CCGA with 1 mil accuracy. Planarity ensures robust, reliable and uniform connections when the CCGA component is mounted to its footprint on an electronic assembly. TopLine CCGA Column Grid Array IC packages are made with high temperature solder columns for Surface Mount (SMT) soldering on Printed Circuit Boards (PCBs). CCGA packages provide more compliancy than BGA solder balls (Ball Grid Arrays) to absorb stress caused by CTE mismatch and increase solder joint reliability under harsh operating conditions.
The TopLine Column Planarizing Tool securely locks the CCGA in place while columns are safely planarized. The procedure is simple; the operator places the CCGA inside of the fixture, and an internal shim allows columns to slightly protrude through a brass plate on the bottom. The operator holds the brass plate face-down on a specially-designed rotating abrasive lapping wheel. Within seconds, all columns are planarized. The final step employs a diamond polishing wheel to shine and polish the tips of the columns before the CCGA is gently removed using an optional extraction tool.
Trimming or lapping is required for CCGA packages with Pb90/Sn10 and Pb80/Sn20 copper-wrapped solder columns. Utilizing the TopLine Column Planarizing Tool is a demonstrated best practice for planarizing solder columns to bring the CCGA into coplanarity. For more information, visit http://www.topline.tv/CCGA_Planar.html.