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KYZEN to Show Cleaner for Cu Pillar Flip Chip Applications at SEMICON West
Thursday, June 15, 2017

KYZEN SEMICON West 17 smToday KYZEN announced plans to exhibit at SEMICON West, in booth #6072, taking place July 11-13, 2017 at the Moscone Center in San Francisco, CA. The KYZEN booth will feature MICRONOX® 2707 for Cu pillar flip chip applications.

MICRONOX MX2707 is designed for the demanding cleaning challenges presented by leadless devices such as BGAs, Flip Chips, QFNs, LGAs and passives. It is optimized to remove organic acid residues of all kinds at low operating concentrations.

MX2707 is a multi-metal safe cleaning chemistry for advanced packaging. Used at low concentrations, MX2707 is safe on exposed metal and effectively cleans under highly dense die.

KYZEN provides world-class cleaning chemistries and cleaning technology from front- to back-end applications. Visit KYZEN’s booth to discover how the company’s innovative solutions can help you achieve your product requirements.

Jason Chan, Global Product Manager, Semiconductor, KYZEN, said, “Electronic products are built by a series of manufacturing processes such as circuit design, advanced packaging and assembly. All of these take a lot of effort and cost. After electronic products are built, the cleaning process is a must to ensure product reliability.”

SEMICON West connects the entire extended electronics supply chain, all in one place, plus provides access to the technical and business intelligence needed to thrive in today’s rapidly changing business environment. It’s the premier place to re-connect with your contacts and make new ones to drive your business forward.

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