The core function of a reflow oven is to produce an acceptable profile on each PCB. The new KIC SPS smart profiler collects the profile data and compares it to the process specifications. Within seconds, the new smart profiler also suggests an improved reflow oven setup.
The new thermal profiler features a small compact design made with an LCP (Liquid Crystal Polymer) enclosure for better heat protection and faster cool-down between profiles. It utilizes a rechargeable battery, profile stacking, private Wi-Fi for wireless data communication plus much more. This all-new smart thermal profiler design has been optimized for maximum thermal protection plus robust long-term operation.
For more information about KIC, visit www.kicthermal.com.