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Alpha to Present and Chair Mulitple Technical Sessions at 2017 SMTA International

Sep 7, 2017

Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will present eight technical papers and will chair three panels during the 2017 SMTAI International Conference and Exhibition on September 17 – 21 held at the Donald E. Stephens Covention Center in Rosemont, Illinois. Three papers will focus on Alpha‘s
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Vi TECHNOLOGY Couples Its 5K3D AOI with the PI Series 3D SPI at ENOVA Paris

Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, will exhibit at ENOVA Paris, scheduled to take place Sept. 19-21, 2017 at the Paris Expo Porte de Versailles. Vi TECHNOLOGY will display its 5K3D AOI system coupled with the PI Series 3D SPI with its agent eXelsius in Hall 4, Booth 18. The 5K3D
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Dr. Mike Bixenman to Teach a Workshop on Reliability, Contamination, Cleaning and Process Control during SMTAi

KYZEN is pleased to announce that Dr. Mike Bixenman will conduct a special workshop during the SMTA International Technical Conference, scheduled to take place Sept. 17-21, 2017 at the Donald E. Stephens Convention Center in Rosemont, IL. The workshop, entitled “Characterization of Soldering Materials, Contaminants, Cleaning Processes and Process Control for Building Reliable Electronic Assemblies,”
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Alpha Assembly Solutions and distributor, MACON to Feature Photovoltaic Products at Biel Light + Building Buenos Aires Show, September 13 – 16, 2017

Aug 31, 2017

Alpha Assembly Solutions’ largest distributor in South America, MACON, will feature Alpha’s diverse portfolio of photovoltaic products at Biel Light + Building Buenos Aries, the most important international event for the electric, electronic and lighting industry of Latin America.  The show takes place September 13 – 16, 2017 at La Rural Trade Center, Buenos Aries, Argentina.
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Ascentech Places Multiple GEN3 Contamination Testers at Amphenol-Borisch, Continuing an Investment in Quality

Ascentech, LLC, a well-known distributor of leading-edge process optimization equipment for electronics manufacturing, has placed two GEN3 Systems’ CM33L+ ionic contamination testers at Amphenol Borisch Technologies (ABT), a vertically integrated Electronics design and manufacturing firm with locations in Grand Rapids (Michigan), Nogales (Mexico) and London (Canada).  Ascentech, LLC is the North American Distributor for GEN3
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TopLine, NASA to Jointly Present Particle Damping Paper at SMTAI 2017

TopLine and NASA will present a joint paper, titled “Practical Design Considerations for Particle Impact Dampers (PID) to Prevent Random Vibration Failures in Printed Circuit Boards,” at SMTAI 2017 in Rosemont, Illinois, Sept. 17-21. It will be presented in Technical Session MFX3 on Wednesday, Sept. 20 from 8:00 a.m. to 10:00 a.m., in the session
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Highly sensitive measurement of ionic residues on electronic PCBAs

PCB cleanliness can be evaluated in accordance with the latest industry standards using a variety of test techniques. In ZESTRON’s state-of-the-art Analytical Center, one of the comprehensive methods employed is Ion Chromatography. This highly sensitive analytical method, provides a detailed report of anions, cations and weak organic acids present on PCBAs according to IPC-TM-650 2.3.28A.
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BTU Launches New TrueFlat Technology to End Die Tilt at SEMICON Taiwan

BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, today announced plans to introduce its new TrueFlat technology, an optional configuration of the PYRAMAX™ convection reflow oven. The unique technology for substrate flatness will be introduced for the first time in Booth 1314 at SEMICON Taiwan, scheduled to
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AIM’s Mehran Maalekian to Present at SMTA International 2017

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dr. Mehran Maalekian, Research & Development Manager, will present the white paper “New Pb-Free Solder Alloy for Demanding Applications” at SMTA International 2017, scheduled to take place on September 17th – September 20th, 2017 at the
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Vi TECHNOLOGY Combines 3D Inspection with SIGMA Link for Smart Factories

Visit Booth #1224 at SMTA International   Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, will exhibit in Booth # 1224 at SMTA International, scheduled to take place September 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, IL. Vi TECHNOLOGY will display its 5K3D AOI coupled with the PI Series
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