Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will present eight technical papers and will chair three panels during the 2017 SMTAI International Conference and Exhibition on September 17 – 21 held at the Donald E. Stephens Covention Center in Rosemont, Illinois.
Three papers will focus on Alpha‘s new products and technologies to be featured during the show — a new generation low temperature solder paste, ALPHA® OM-550 and the innovative void reduction ALPHA® AccuFlux™ Technology for solder preforms. One of the papers will discuss Alpha’s lastest work on the low temperature technology, Low Temperature Soldering Using Sn-Bi Alloys.
New technology for reducing voiding will be the focus of the presentation, Void Reduction Strategy for Bottom Termination Components (BTC) Using Special Flux Coated Preforms. “Alpha is looking forward to presenting our new product innovations and educating our customers on the value associated with these technologies.“, said Robert Wallace, Regional Marketing Manager for the Americas. “We believe that the increased reliability and efficiencies with cost will be of considerable use to our customers.“
Additional papers will address the topic of voiding, as well as, alloys for LEDs and SMT assembly, interconnect materials, and testing:
Effect of Voids on Thermo-Mechanical Reliability of Solder Joints and Process, Design
Material Factors for Voiding Control for Thermally Demanding Applications
Novel Mid-Temperature Alloy for Enabling Solder Processing Temperature Heirarchy in SMT Assembly
High Performance Electronic Interconnect Materials Characterization– Techniques & Challenges
A Comparison of Localized Electronics Cleanliness Testing and Surface Insulation Resistance
Alpha will also chair or co-chair three technical sessions for Quality & Reliability, Solder Alloys, and Reflow.