Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, is introducing its newest solder paste innovation for ultra-fine feature printing and reflow applications.
ALPHA® OM-347 is an ultra-cleanable, no-clean, lead-free, zero-halogen solder paste material that can print and reflow Type 4 and Type 5 powder to meet market segments requiring ultra-fine feature applications.
“ALPHA® OM-347 is one of the first solder paste formulas introduced specifically designed as an ultra-cleanable, no-clean material”, said Traian Cucu, Global Product Manager for Solder Paste at Alpha Assembly Solutions, a part of the MacDermid Performance Solutions Group of Businesses. “It has an outstanding reflow process window that delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes and shows excellent random solder ball and mid-chip solder ball resistance.”
This new soldering material from Alpha demonstrates excellent print volume deposit repeatability, thereby providing value to customers by reducing defects that can derive from print process variability.