AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Flopy Feng, Technical Support Engineer, received the award for Best Presentation in his technical session at the SMTA China South Technology Conference in Shenzhen, China.
Flopy’s presentation, titled “The Impact of Reduced Solder Alloy Powder Size on Solder Paste Print Performance,” generated great interest among attendees. It highlighted the benefits and implications of finer mesh solder powder on critical aspects of solder paste performance. In this study, the key input variables included powder size, effect of room temperature storage, pause time and PCB feature types. Output included print transfer efficiency, volume repeatability and performance stability over time.
Flopy Feng is a Technical Support Engineer for AIM Solder. Having worked as a process supervisor for seven years, he is experienced in process evaluation and optimization. With over fourteen years’ experience in the SMT industry, Flopy supports AIM customers in south China.